💡如何從晶背找出先進封裝的錫球異常點？ 在進行先進封裝的檢測分析前，一般會先研磨 PCB 載板，再用酸液取下晶片 (Die)來進行異常點分析觀察。然而，若異常點出現在錫球，只能另尋他法進行。 該如...

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